Hybrid Thermal and EMI Absorber Material K=1.8

Hybrid Thermal and EMI Absorber Material K=1.8 Datasheets Features
Effective to aborb and damp a wide range of electromagnetic waves

Easily filling small gap and uneven surfaces with soft gel

For a wide application temperature range

Applications
Telecommunications

Camera

RF modules

High frequency IC chip
Description
XK-J series will solve both thermal transfer and EMI issues in limited space at the same, also simplify the mechanical desgin to reduce cost and improve performance. The silicone base is suitable for low stress and big tolerance applications.