Non silicone thermal pad K=5.0

Non silicone thermal pad K=5.0 Datasheets Features
No siloxane volatiles

High thermal performance

Exellent compressibility

Low hardness, conformable

Electrical insulation

Applications
Optical precision devices

Telecommunication

Industrial and medical electronics

Automotive ECU

Description
XK-PN50 is a soft and compliant thermal gap filler pad with thermal conductivity of 5.0W/mK. It offers exceptional thermal performance at low pressure due to low-modulus formulation. Designed for silicone-sensitive applications, offering high electrical insulation and excellent thermally conductive.