Silicone free thermal compond K=0.8

Silicone free thermal compond K=0.8 Datasheets Features
Epoxy resin based

Strong structural bond

Excellent mechanical and

chemical stability

Fast cure with additional heat

Applications
Automotive electronics

Telecommunications

Motor

Description
XK-SN10 is a two part thermal compound with high bond strength, it is supplied in two-part, suitable for automated dispensing. It can cure at room temperature, or can be accelerated with additional heat. It is ideal for motor thermal transfer.