Silicone free thermal compound K=1.5

Silicone free thermal compound K=1.5 Datasheets Features
Epoxy resin based

Strong structural bond

Excellent mechanical and

chemical stability

Fast cure with additional heat

Applications
Automotive electronics

Telecommunications

Motor
Description
XK-SN20 is a two part, epoxy resin based thermal gap filling material with high bonding strength, this material is suitable for automated dispensing. It cures at room temperature or can be accelerated with additional heat. It is ideal for motor thermal management.